Onsemi Vietnam ★ 3.4

- Successfully perform failure analyses on internally generated failures from new product development activities, qualification, design debug as well as customer returns.

- Isolate failure mechanisms on a very wide variety of product lines including complex Image Sensors, ASICs, Analog, Mixed Signal, Digital Logic, Filters, and Smart Discretes.

- Analyze background information, ATE data logs, X-Ray, and SAT results. Characterize the failure mode on the bench using semiconductor parameter analyzers, oscilloscopes, function generators, logic testers, application boards and other general purpose bench equipment to develop an appropriate analysis plan.

- Employ and interpret core fault localization techniques such as PEM and OBIRCH, while considering CAD layout, schematic and failure mode information.

- Direct and oversee material and physical analysis efforts including SEM, FIB, TEM, EDS, Auger, FTIR, SIMS, etc. to visualize the failure mechanism.

- Comprehensively and clearly document the analyses, succinctly linking failure mechanism to the failure mode as a part of the 8D problem solving process.